Nongshim said on Dec. 11 that it won the top prize, the grand prize, at the 2025 Korea Package Design Competition. At the 34th Korea Package Competition this year, Nongshim was selected as the grand ...
SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...
Editor’s note: This story highlights takeaways from an Oct. 15 event hosted by Packaging Dive and Food Dive. Register here to watch the replay on demand. For some CPG companies, food packaging design ...
Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
Esko ArtiosCAD is the world’s leading structural design and dieline creation software for packaging professionals. It enables designers and engineers to create, visualize, and validate packaging ...
Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...
Figma CEO Dylan Field stands to be very wealthy if he can hit the marks outlined in his pay package. The design software maker's trading debut puts big awards within reach. Field could make $1.9 ...
Give your holiday cake slices a festive flair with this creative packaging tutorial! From simple wraps to eye-catching ribbons and DIY boxes, learn how to turn every slice into a beautiful edible gift ...
Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...
When 2025 began, packaging experts agreed that the number one trend in their industry this year would be sustainable materials, ranging from biodegradable and compostable packaging to eco-friendly ...
LAUSANNE, Switzerland & SAN JOSE, Calif.--(BUSINESS WIRE)--Logitech International (SIX: LOGN) (Nasdaq: LOGI) today announces significant progress in eliminating plastic clamshell packaging from its ...
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